| Processor |
|---|
| Processor generation | Intel Xeon Scalable 4th Gen |
| Processor base frequency | 2.9 GHz |
| Processor manufacturer | Intel |
| Processor codename | Sapphire Rapids |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 22.5 MB |
| Processor ARK ID | 232373 |
| Processor model | 5415+ |
| Processor threads | 16 |
| System bus rate | 16 GT/s |
| Processor boost frequency | 4.1 GHz |
| Stepping | S3 |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 8 |
| Processor socket | LGA 4677 (Socket E) |
| High priority cores | 2 |
| High priority core frequency | 3.1 GHz |
| Low priority cores | 6 |
| Memory |
|---|
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR5-SDRAM |
| Supported memory types | DDR5-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics |
|---|
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power |
|---|
| Thermal Design Power (TDP) | 150 W |
| Technical details |
|---|
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Supported memory types | DDR5-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'23 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 4400 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E1B |
| Features |
|---|
| Maximum number of PCI Express lanes | 80 |
| Thermal Design Power (TDP) | 150 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 232373 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Use conditions | Server/Enterprise |
| Processor special features |
|---|
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® OS Guard | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Maximum Enclave Size Support for Intel® SGX | 128 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® On Demand Feature Activation | Yes |
| Intel® QuickAssist Technology (QAT) | 1 default devices |
| Intel® Dynamic Load Balancer (DLB) | 1 default devices |
| Intel® Data Streaming Accelerator (DSA) | 1 default devices |
| Intel® In-memory Analytics Accelerator (IAA) | 1 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Operational conditions |
|---|
| Tcase | 78 °C |
| DTS Max | 99 °C |
| Packaging data |
|---|
| Package type | Retail box |
| Weight & dimensions |
|---|
| Processor package size | 77.5 x 56.5 mm |
| Other features |
|---|
| Maximum internal memory | 4 TB |
