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Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Save £181.63
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Save £202.99
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i5 |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 12 MB |
Processor ARK ID | 199278 |
Processor model | i5-10400F |
Processor threads | 12 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i5 |
Processor cores | 6 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199278 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | No |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 4.3 GHz |
Intel® Transactional Synchronization Extensions | No |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i5 |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 12 MB |
Processor ARK ID | 199278 |
Processor model | i5-10400F |
Processor threads | 12 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i5 |
Processor cores | 6 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199278 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | No |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 4.3 GHz |
Intel® Transactional Synchronization Extensions | No |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Save £36.10
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 20 MB |
Processor ARK ID | 199329 |
Processor model | i9-10900F |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199329 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 5 GHz |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.1 GHz |
Intel® Transactional Synchronization Extensions | No |
Intel® Thermal Velocity Boost Temperature | 70 °C |
Intel® Thermal Velocity Boost Frequency | 5.2 GHz |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 20 MB |
Processor ARK ID | 199329 |
Processor model | i9-10900F |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199329 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 5 GHz |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.1 GHz |
Intel® Transactional Synchronization Extensions | No |
Intel® Thermal Velocity Boost Temperature | 70 °C |
Intel® Thermal Velocity Boost Frequency | 5.2 GHz |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Save £131.06
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i3 |
Processor base frequency | 3.6 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 6 MB |
Processor ARK ID | 203473 |
Processor model | i3-10100F |
Processor threads | 8 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i3 |
Processor cores | 4 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 203473 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | No |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 4.3 GHz |
Intel® Transactional Synchronization Extensions | No |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i3 |
Processor base frequency | 3.6 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 6 MB |
Processor ARK ID | 203473 |
Processor model | i3-10100F |
Processor threads | 8 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i3 |
Processor cores | 4 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 203473 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | No |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 4.3 GHz |
Intel® Transactional Synchronization Extensions | No |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Save £30.76
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £566.03
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 16.5 MB |
Processor model | 4214R |
Processor threads | 24 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 12 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 16.5 MB |
Processor model | 4214R |
Processor threads | 24 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 12 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £464.48
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 32 MB |
Processor model | 5800X |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.7 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 7 |
Processor cores | 8 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 32 MB |
Processor model | 5800X |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.7 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 7 |
Processor cores | 8 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £115.59
Processor | |
---|---|
Processor base frequency | 3.7 GHz |
Processor manufacturer | AMD |
Cooler included | Yes |
Thermal Design Power (TDP) | 65 W |
Processor cache | 32 MB |
Processor model | 5600X |
Processor threads | 12 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.6 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 5 |
Processor cores | 6 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 65 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 65 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3.7 GHz |
Processor manufacturer | AMD |
Cooler included | Yes |
Thermal Design Power (TDP) | 65 W |
Processor cache | 32 MB |
Processor model | 5600X |
Processor threads | 12 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.6 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 5 |
Processor cores | 6 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 65 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 65 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £86.16
Processor | |
---|---|
Processor base frequency | 3.4 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 64 MB |
Processor model | 5950X |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.9 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3.4 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 64 MB |
Processor model | 5950X |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.9 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 16 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £209.52
Processor | |
---|---|
Processor base frequency | 3.7 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 64 MB |
Processor model | 5900X |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.8 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 12 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3.7 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 105 W |
Processor cache | 64 MB |
Processor model | 5900X |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.8 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 9 |
Processor cores | 12 |
Box | Yes |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Technical details | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 105 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £171.97
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 105 W |
Processor cache | 32 MB |
Processor model | 5800X |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.7 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 7 |
Processor cores | 8 |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Features | |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Technical details | |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 105 W |
Processor cache | 32 MB |
Processor model | 5800X |
Processor threads | 16 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.7 GHz |
Component for | PC |
Processor lithography | 7 nm |
Processor family | AMD Ryzen™ 7 |
Processor cores | 8 |
Processor socket | Socket AM4 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 105 W |
Features | |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Technical details | |
Thermal Design Power (TDP) | 105 W |
Market segment | Desktop |
Processor cache type | L3 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £120.53