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| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 5220R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 5220R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £1,081.46
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor model | 6248R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor model | 6248R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
Save £2,358.96
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £566.03
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £544.56
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Thermal Design Power (TDP) | 135 W |
| Processor cache | 24 MB |
| Processor model | 4314 |
| Processor threads | 32 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 135 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 135 W |
| Market segment | Server |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 135 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Thermal Design Power (TDP) | 135 W |
| Processor cache | 24 MB |
| Processor model | 4314 |
| Processor threads | 32 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 135 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 135 W |
| Market segment | Server |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 135 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £367.94
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £259.56
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Processor model | 7313 |
| Processor threads | 128 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Technical details | |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Processor model | 7313 |
| Processor threads | 128 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Technical details | |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
Save £595.97
| Processor | |
|---|---|
| Processor generation | Intel Xeon Scalable 4th Gen |
| Processor base frequency | 2.5 GHz |
| Processor manufacturer | Intel |
| Processor codename | Sapphire Rapids |
| Thermal Design Power (TDP) | 185 W |
| Processor cache | 37.5 MB |
| Processor ARK ID | 232377 |
| Processor model | 6426Y |
| Processor threads | 32 |
| System bus rate | 16 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Stepping | S3 |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4677 (Socket E) |
| High priority cores | 4 |
| High priority core frequency | 2.7 GHz |
| Low priority cores | 12 |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 185 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 185 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'23 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 4800 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E1B |
| Features | |
| Maximum number of PCI Express lanes | 80 |
| Thermal Design Power (TDP) | 185 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 232377 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G180729 |
| Use conditions | Server/Enterprise |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® OS Guard | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Maximum Enclave Size Support for Intel® SGX | 128 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® On Demand Feature Activation | Yes |
| Intel® Data Streaming Accelerator (DSA) | 1 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Operational conditions | |
| Tcase | 80 °C |
| DTS Max | 95 °C |
| Logistics data | |
| Harmonized System (HS) code | 8542310001 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 4 TB |
| Processor | |
|---|---|
| Processor generation | Intel Xeon Scalable 4th Gen |
| Processor base frequency | 2.5 GHz |
| Processor manufacturer | Intel |
| Processor codename | Sapphire Rapids |
| Thermal Design Power (TDP) | 185 W |
| Processor cache | 37.5 MB |
| Processor ARK ID | 232377 |
| Processor model | 6426Y |
| Processor threads | 32 |
| System bus rate | 16 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Stepping | S3 |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4677 (Socket E) |
| High priority cores | 4 |
| High priority core frequency | 2.7 GHz |
| Low priority cores | 12 |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 185 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 185 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'23 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 4800 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E1B |
| Features | |
| Maximum number of PCI Express lanes | 80 |
| Thermal Design Power (TDP) | 185 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 232377 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G180729 |
| Use conditions | Server/Enterprise |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® OS Guard | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Maximum Enclave Size Support for Intel® SGX | 128 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® On Demand Feature Activation | Yes |
| Intel® Data Streaming Accelerator (DSA) | 1 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Operational conditions | |
| Tcase | 80 °C |
| DTS Max | 95 °C |
| Logistics data | |
| Harmonized System (HS) code | 8542310001 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 4 TB |
Save £788.05
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 11 MB |
| Processor model | 4215R |
| Processor threads | 16 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 11 MB |
| Processor model | 4215R |
| Processor threads | 16 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £830.81
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 11 MB |
| Processor model | 4215R |
| Processor threads | 16 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 11 MB |
| Processor model | 4215R |
| Processor threads | 16 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
Save £924.42
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.5 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 11 MB |
| Processor model | 4215 |
| Processor threads | 16 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 85 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 85 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.5 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 11 MB |
| Processor model | 4215 |
| Processor threads | 16 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 85 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 85 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
Save £455.87
