Processor
Processor base frequency	2.13 GHz
Thermal Design Power (TDP)	105 W
Processor cache	24 MB
Processor model	E7-2830
Processor threads	16
System bus rate	6.4 GT/s
Processor operating modes	64-bit
Processor boost frequency	2.4 GHz
Stepping	A2
CPU multiplier (bus/core ratio)	16
Component for	Server/workstation
Processor lithography	32 nm
Processor family	Intel® Xeon® E7 Family
Processor cores	8
Box	No
Processor socket	LGA 1567 (Socket LS)
Processor cache type	L3
Power
Thermal Design Power (TDP)	105 W
Features
Thermal Design Power (TDP)	105 W
Market segment	Server
Operational conditions
Maximum operating temperature	64 °C
Technical details
Thermal Design Power (TDP)	105 W
Market segment	Server
Processor cache type	L3

Processor
Processor base frequency	2.13 GHz
Thermal Design Power (TDP)	105 W
Processor cache	24 MB
Processor model	E7-2830
Processor threads	16
System bus rate	6.4 GT/s
Processor operating modes	64-bit
Processor boost frequency	2.4 GHz
Stepping	A2
CPU multiplier (bus/core ratio)	16
Component for	Server/workstation
Processor lithography	32 nm
Processor family	Intel® Xeon® E7 Family
Processor cores	8
Box	No
Processor socket	LGA 1567 (Socket LS)
Processor cache type	L3
Power
Thermal Design Power (TDP)	105 W
Features
Thermal Design Power (TDP)	105 W
Market segment	Server
Operational conditions
Maximum operating temperature	64 °C
Technical details
Thermal Design Power (TDP)	105 W
Market segment	Server
Processor cache type	L3

Processor
Processor base frequency	2.5 GHz
Memory bandwidth supported by processor (max)	42.6 GB/s
Thermal Design Power (TDP)	95 W
Processor cache	15 MB
Processor model	E5-2640
Processor threads	12
System bus rate	7.20 GT/s
Processor operating modes	64-bit
VID Voltage Range	0.6 - 1.35 V
Processor boost frequency	3 GHz
CPU multiplier (bus/core ratio)	30
Component for	Server/workstation
Processor lithography	32 nm
Processor family	Intel® Xeon® E5 Family
Processor cores	6
Box	No
Processor socket	LGA 2011 (Socket R)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	750 GB
Memory clock speeds supported by processor	800,1066,1333 MHz
Memory bandwidth supported by processor (max)	42.6 GB/s
Memory channels	Quad-channel
ECC	Yes
Power
Thermal Design Power (TDP)	95 W
VID Voltage Range	0.6 - 1.35 V
Features
Thermal Design Power (TDP)	95 W
Market segment	Server
Harmonized System (HS) code	85423119
Operational conditions
Maximum operating temperature	77.4 °C
Technical details
Thermal Design Power (TDP)	95 W
Market segment	Server
Processor cache type	L3
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.5 GHz
Memory bandwidth supported by processor (max)	42.6 GB/s
Thermal Design Power (TDP)	95 W
Processor cache	15 MB
Processor model	E5-2640
Processor threads	12
System bus rate	7.20 GT/s
Processor operating modes	64-bit
VID Voltage Range	0.6 - 1.35 V
Processor boost frequency	3 GHz
CPU multiplier (bus/core ratio)	30
Component for	Server/workstation
Processor lithography	32 nm
Processor family	Intel® Xeon® E5 Family
Processor cores	6
Box	No
Processor socket	LGA 2011 (Socket R)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	750 GB
Memory clock speeds supported by processor	800,1066,1333 MHz
Memory bandwidth supported by processor (max)	42.6 GB/s
Memory channels	Quad-channel
ECC	Yes
Power
Thermal Design Power (TDP)	95 W
VID Voltage Range	0.6 - 1.35 V
Features
Thermal Design Power (TDP)	95 W
Market segment	Server
Harmonized System (HS) code	85423119
Operational conditions
Maximum operating temperature	77.4 °C
Technical details
Thermal Design Power (TDP)	95 W
Market segment	Server
Processor cache type	L3
Logistics data
Harmonized System (HS) code	85423119

Processors