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| Hard drive | |
|---|---|
| SSD capacity | 960 GB |
| Memory type | V-NAND TLC |
| Data transmission | |
| Random write (4KB) | 31000 IOPS |
| Random read (4KB) | 98000 IOPS |
| Data transfer rate | 6 Gbit/s |
| Endurance | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Mean time between failures (MTBF) | 2000000 h |
| Certificates | |
| Certification | UL TUV FCC CE Mark C-Tick Mark BSMI (Taiwan) KCC (Korea EMI) |
| Performance | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| Hot-swap | Yes |
| SSD capacity | 960 GB |
| S.M.A.R.T. support | Yes |
| Memory type | V-NAND TLC |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 31000 IOPS |
| Random read (4KB) | 98000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Hardware encryption | No |
| Data transfer rate | 6 Gbit/s |
| Design | |
| Component for | Server/workstation |
| Certification | UL TUV FCC CE Mark C-Tick Mark BSMI (Taiwan) KCC (Korea EMI) |
| SSD form factor | 2.5" |
| Features | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| Hot-swap | Yes |
| SSD capacity | 960 GB |
| S.M.A.R.T. support | Yes |
| Memory type | V-NAND TLC |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 31000 IOPS |
| Random read (4KB) | 98000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Hardware encryption | No |
| Data transfer rate | 6 Gbit/s |
| Certification | UL TUV FCC CE Mark C-Tick Mark BSMI (Taiwan) KCC (Korea EMI) |
| SSD form factor | 2.5" |
| Random latency - read (up to) | 120 µs |
| Random latency - write (up to) | 40 µs |
| Drive writes per day (DWPD) | 1 |
| Power | |
| Power consumption (write) | 3.2 W |
| Power consumption (read) | 2.2 W |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Non-operating shock | 1500 G |
| Non-operating vibration | 20 G |
| Maximum operating altitude | 3050 m |
| Technical details | |
| Interface | Serial ATA III |
| Hot-swap | Yes |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | 0 - 70 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Non-operating shock | 1500 G |
| Non-operating vibration | 20 G |
| Maximum operating altitude | 3050 m |
| Hardware encryption | No |
| SSD form factor | 2.5" |
| Weight & dimensions | |
| Package width | 133 mm |
| Package depth | 174 mm |
| Package height | 63 mm |
| Package weight | 433 g |
| Width | 70 mm |
| Weight | 58 g |
| Height | 7 mm |
| Depth | 100 mm |
| Packaging data | |
| Package width | 133 mm |
| Package depth | 174 mm |
| Package height | 63 mm |
| Package weight | 433 g |
| Other features | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Hard drive | |
|---|---|
| SSD capacity | 960 GB |
| Memory type | V-NAND TLC |
| Data transmission | |
| Random write (4KB) | 31000 IOPS |
| Random read (4KB) | 98000 IOPS |
| Data transfer rate | 6 Gbit/s |
| Endurance | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Mean time between failures (MTBF) | 2000000 h |
| Certificates | |
| Certification | UL TUV FCC CE Mark C-Tick Mark BSMI (Taiwan) KCC (Korea EMI) |
| Performance | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| Hot-swap | Yes |
| SSD capacity | 960 GB |
| S.M.A.R.T. support | Yes |
| Memory type | V-NAND TLC |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 31000 IOPS |
| Random read (4KB) | 98000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Hardware encryption | No |
| Data transfer rate | 6 Gbit/s |
| Design | |
| Component for | Server/workstation |
| Certification | UL TUV FCC CE Mark C-Tick Mark BSMI (Taiwan) KCC (Korea EMI) |
| SSD form factor | 2.5" |
| Features | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| Hot-swap | Yes |
| SSD capacity | 960 GB |
| S.M.A.R.T. support | Yes |
| Memory type | V-NAND TLC |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 31000 IOPS |
| Random read (4KB) | 98000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Hardware encryption | No |
| Data transfer rate | 6 Gbit/s |
| Certification | UL TUV FCC CE Mark C-Tick Mark BSMI (Taiwan) KCC (Korea EMI) |
| SSD form factor | 2.5" |
| Random latency - read (up to) | 120 µs |
| Random latency - write (up to) | 40 µs |
| Drive writes per day (DWPD) | 1 |
| Power | |
| Power consumption (write) | 3.2 W |
| Power consumption (read) | 2.2 W |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Non-operating shock | 1500 G |
| Non-operating vibration | 20 G |
| Maximum operating altitude | 3050 m |
| Technical details | |
| Interface | Serial ATA III |
| Hot-swap | Yes |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | 0 - 70 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Non-operating shock | 1500 G |
| Non-operating vibration | 20 G |
| Maximum operating altitude | 3050 m |
| Hardware encryption | No |
| SSD form factor | 2.5" |
| Weight & dimensions | |
| Package width | 133 mm |
| Package depth | 174 mm |
| Package height | 63 mm |
| Package weight | 433 g |
| Width | 70 mm |
| Weight | 58 g |
| Height | 7 mm |
| Depth | 100 mm |
| Packaging data | |
| Package width | 133 mm |
| Package depth | 174 mm |
| Package height | 63 mm |
| Package weight | 433 g |
| Other features | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
Save £465.16
| Hard drive | |
|---|---|
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Data transmission | |
| Random write (4KB) | 33000 IOPS |
| Random read (4KB) | 95000 IOPS |
| Write latency | 80 µs |
| Read latency | 170 µs |
| Data transfer rate | 6 Gbit/s |
| Security | |
| Security algorithms | 256-bit AES |
| Endurance | |
| Mean time between failures (MTBF) | 3000000 h |
| Certificates | |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
| Performance | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| NVMe | No |
| Hot-swap | No |
| SSD capacity | 960 GB |
| Security algorithms | 256-bit AES |
| S.M.A.R.T. support | Yes |
| Memory type | 3D TLC NAND |
| Random write (4KB) | 33000 IOPS |
| Random read (4KB) | 95000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| Write latency | 80 µs |
| Read latency | 170 µs |
| Data transfer rate | 6 Gbit/s |
| Compatible products | ThinkSystem |
| Design | |
| Component for | Server/workstation |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
| SSD form factor | 2.5" |
| Features | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| NVMe | No |
| Hot-swap | No |
| SSD capacity | 960 GB |
| Security algorithms | 256-bit AES |
| S.M.A.R.T. support | Yes |
| Memory type | 3D TLC NAND |
| Random write (4KB) | 33000 IOPS |
| Random read (4KB) | 95000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| Write latency | 80 µs |
| Read latency | 170 µs |
| Data transfer rate | 6 Gbit/s |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
| SSD form factor | 2.5" |
| Compatible products | ThinkSystem |
| Power | |
| Power consumption (write) | 3.1 W |
| Power consumption (read) | 2.8 W |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Storage relative humidity (H-H) | 5 - 95% |
| Technical details | |
| Interface | Serial ATA III |
| Hot-swap | No |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Storage relative humidity (H-H) | 5 - 95% |
| SSD form factor | 2.5" |
| Weight & dimensions | |
| Width | 70 mm |
| Weight | 70 g |
| Height | 7 mm |
| Depth | 100 mm |
| Hard drive | |
|---|---|
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Data transmission | |
| Random write (4KB) | 33000 IOPS |
| Random read (4KB) | 95000 IOPS |
| Write latency | 80 µs |
| Read latency | 170 µs |
| Data transfer rate | 6 Gbit/s |
| Security | |
| Security algorithms | 256-bit AES |
| Endurance | |
| Mean time between failures (MTBF) | 3000000 h |
| Certificates | |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
| Performance | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| NVMe | No |
| Hot-swap | No |
| SSD capacity | 960 GB |
| Security algorithms | 256-bit AES |
| S.M.A.R.T. support | Yes |
| Memory type | 3D TLC NAND |
| Random write (4KB) | 33000 IOPS |
| Random read (4KB) | 95000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| Write latency | 80 µs |
| Read latency | 170 µs |
| Data transfer rate | 6 Gbit/s |
| Compatible products | ThinkSystem |
| Design | |
| Component for | Server/workstation |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
| SSD form factor | 2.5" |
| Features | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| NVMe | No |
| Hot-swap | No |
| SSD capacity | 960 GB |
| Security algorithms | 256-bit AES |
| S.M.A.R.T. support | Yes |
| Memory type | 3D TLC NAND |
| Random write (4KB) | 33000 IOPS |
| Random read (4KB) | 95000 IOPS |
| Mean time between failures (MTBF) | 3000000 h |
| Write latency | 80 µs |
| Read latency | 170 µs |
| Data transfer rate | 6 Gbit/s |
| Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
| SSD form factor | 2.5" |
| Compatible products | ThinkSystem |
| Power | |
| Power consumption (write) | 3.1 W |
| Power consumption (read) | 2.8 W |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Storage relative humidity (H-H) | 5 - 95% |
| Technical details | |
| Interface | Serial ATA III |
| Hot-swap | No |
| S.M.A.R.T. support | Yes |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating relative humidity (H-H) | 5 - 95% |
| Storage relative humidity (H-H) | 5 - 95% |
| SSD form factor | 2.5" |
| Weight & dimensions | |
| Width | 70 mm |
| Weight | 70 g |
| Height | 7 mm |
| Depth | 100 mm |
Save £186.40
| Hard drive | |
|---|---|
| SSD capacity | 1 TB |
| Performance | |
| Interface | PCI Express 3.0 |
| Component for | Laptop |
| NVMe | Yes |
| SSD capacity | 1 TB |
| Compatible products | ThinkPad X1 Carbon 6th Gen |
| Design | |
| Component for | Laptop |
| SSD form factor | M.2 |
| Features | |
| Interface | PCI Express 3.0 |
| Component for | Laptop |
| NVMe | Yes |
| SSD capacity | 1 TB |
| SSD form factor | M.2 |
| Compatible products | ThinkPad X1 Carbon 6th Gen |
| Power | |
| Current | 2.8 A |
| Operating voltage | 3.3 V |
| Technical details | |
| Interface | PCI Express 3.0 |
| SSD form factor | M.2 |
| Hard drive | |
|---|---|
| SSD capacity | 1 TB |
| Performance | |
| Interface | PCI Express 3.0 |
| Component for | Laptop |
| NVMe | Yes |
| SSD capacity | 1 TB |
| Compatible products | ThinkPad X1 Carbon 6th Gen |
| Design | |
| Component for | Laptop |
| SSD form factor | M.2 |
| Features | |
| Interface | PCI Express 3.0 |
| Component for | Laptop |
| NVMe | Yes |
| SSD capacity | 1 TB |
| SSD form factor | M.2 |
| Compatible products | ThinkPad X1 Carbon 6th Gen |
| Power | |
| Current | 2.8 A |
| Operating voltage | 3.3 V |
| Technical details | |
| Interface | PCI Express 3.0 |
| SSD form factor | M.2 |
Save £144.10
| Hard drive | |
|---|---|
| SSD capacity | 1000 GB |
| Performance | |
| Interface | PCI Express 3.0 |
| Component for | Notebook |
| SSD capacity | 1000 GB |
| Compatible products | ThinkPad T480s |
| Design | |
| Component for | Notebook |
| SSD form factor | M.2 |
| Features | |
| Interface | PCI Express 3.0 |
| Component for | Notebook |
| SSD capacity | 1000 GB |
| SSD form factor | M.2 |
| Compatible products | ThinkPad T480s |
| Technical details | |
| Interface | PCI Express 3.0 |
| SSD form factor | M.2 |
| Hard drive | |
|---|---|
| SSD capacity | 1000 GB |
| Performance | |
| Interface | PCI Express 3.0 |
| Component for | Notebook |
| SSD capacity | 1000 GB |
| Compatible products | ThinkPad T480s |
| Design | |
| Component for | Notebook |
| SSD form factor | M.2 |
| Features | |
| Interface | PCI Express 3.0 |
| Component for | Notebook |
| SSD capacity | 1000 GB |
| SSD form factor | M.2 |
| Compatible products | ThinkPad T480s |
| Technical details | |
| Interface | PCI Express 3.0 |
| SSD form factor | M.2 |
Save £172.05
| Hard drive | |
|---|---|
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Data transmission | |
| Random write (4KB) | 43000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Data transfer rate | 6 Gbit/s |
| Endurance | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Mean time between failures (MTBF) | 2000000 h |
| Certificates | |
| Certification | FCC Title 47, Part 15B, Class B EN-55035:2017 EN-55022:2006 EN-55032:2012 Low Voltage Directive (LVD) 2014/35/EU EMC Directive 2014/30/EU RoHS Directive 2011/65/EU WEEE Directive 2012/19/EU UL 60950-1, 2nd Edition, 2014-10-14 CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-010 UL/CSA 62368-1, 2nd Edition AS/NZ CISPR 32:2015 AS/NZ CISPR 22:2009 +A1:2010 Taiwan BSMI EMC standard CNS 13438 Korea KCC Article 11.1 Morocco Decree # 2574-14 (EMC) Canada ICES-003 Japan VCCI China EFUP |
| Performance | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 43000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Data transfer rate | 6 Gbit/s |
| Design | |
| Component for | Server/workstation |
| Certification | FCC Title 47, Part 15B, Class B EN-55035:2017 EN-55022:2006 EN-55032:2012 Low Voltage Directive (LVD) 2014/35/EU EMC Directive 2014/30/EU RoHS Directive 2011/65/EU WEEE Directive 2012/19/EU UL 60950-1, 2nd Edition, 2014-10-14 CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-010 UL/CSA 62368-1, 2nd Edition AS/NZ CISPR 32:2015 AS/NZ CISPR 22:2009 +A1:2010 Taiwan BSMI EMC standard CNS 13438 Korea KCC Article 11.1 Morocco Decree # 2574-14 (EMC) Canada ICES-003 Japan VCCI China EFUP |
| SSD form factor | 3.5" |
| Features | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 43000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Data transfer rate | 6 Gbit/s |
| Certification | FCC Title 47, Part 15B, Class B EN-55035:2017 EN-55022:2006 EN-55032:2012 Low Voltage Directive (LVD) 2014/35/EU EMC Directive 2014/30/EU RoHS Directive 2011/65/EU WEEE Directive 2012/19/EU UL 60950-1, 2nd Edition, 2014-10-14 CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-010 UL/CSA 62368-1, 2nd Edition AS/NZ CISPR 32:2015 AS/NZ CISPR 22:2009 +A1:2010 Taiwan BSMI EMC standard CNS 13438 Korea KCC Article 11.1 Morocco Decree # 2574-14 (EMC) Canada ICES-003 Japan VCCI China EFUP |
| SSD form factor | 3.5" |
| Random latency - read (up to) | 102 µs |
| Random latency - write (up to) | 49 µs |
| Sequential latency - read (up to) | 36 µs |
| Sequential latency - write (up to) | 36 µs |
| Drive writes per day (DWPD) | 2.5 |
| Power | |
| Power consumption (write) | 3 W |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage relative humidity (H-H) | 5 - 95% |
| Operating shock | 1000 G |
| Non-operating shock | 1000 G |
| Operating vibration | 2.17 G |
| Non-operating vibration | 3.13 G |
| Technical details | |
| Interface | Serial ATA III |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage relative humidity (H-H) | 5 - 95% |
| Operating shock | 1000 G |
| Non-operating shock | 1000 G |
| Operating vibration | 2.17 G |
| Non-operating vibration | 3.13 G |
| SSD form factor | 3.5" |
| Weight & dimensions | |
| Width | 257 mm |
| Weight | 484 g |
| Height | 95 mm |
| Depth | 193 mm |
| Other features | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Hard drive | |
|---|---|
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Data transmission | |
| Random write (4KB) | 43000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Data transfer rate | 6 Gbit/s |
| Endurance | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Mean time between failures (MTBF) | 2000000 h |
| Certificates | |
| Certification | FCC Title 47, Part 15B, Class B EN-55035:2017 EN-55022:2006 EN-55032:2012 Low Voltage Directive (LVD) 2014/35/EU EMC Directive 2014/30/EU RoHS Directive 2011/65/EU WEEE Directive 2012/19/EU UL 60950-1, 2nd Edition, 2014-10-14 CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-010 UL/CSA 62368-1, 2nd Edition AS/NZ CISPR 32:2015 AS/NZ CISPR 22:2009 +A1:2010 Taiwan BSMI EMC standard CNS 13438 Korea KCC Article 11.1 Morocco Decree # 2574-14 (EMC) Canada ICES-003 Japan VCCI China EFUP |
| Performance | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 43000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Data transfer rate | 6 Gbit/s |
| Design | |
| Component for | Server/workstation |
| Certification | FCC Title 47, Part 15B, Class B EN-55035:2017 EN-55022:2006 EN-55032:2012 Low Voltage Directive (LVD) 2014/35/EU EMC Directive 2014/30/EU RoHS Directive 2011/65/EU WEEE Directive 2012/19/EU UL 60950-1, 2nd Edition, 2014-10-14 CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-010 UL/CSA 62368-1, 2nd Edition AS/NZ CISPR 32:2015 AS/NZ CISPR 22:2009 +A1:2010 Taiwan BSMI EMC standard CNS 13438 Korea KCC Article 11.1 Morocco Decree # 2574-14 (EMC) Canada ICES-003 Japan VCCI China EFUP |
| SSD form factor | 3.5" |
| Features | |
| Interface | Serial ATA III |
| Component for | Server/workstation |
| SSD capacity | 960 GB |
| Memory type | 3D TLC NAND |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
| Random write (4KB) | 43000 IOPS |
| Random read (4KB) | 90000 IOPS |
| Mean time between failures (MTBF) | 2000000 h |
| Data transfer rate | 6 Gbit/s |
| Certification | FCC Title 47, Part 15B, Class B EN-55035:2017 EN-55022:2006 EN-55032:2012 Low Voltage Directive (LVD) 2014/35/EU EMC Directive 2014/30/EU RoHS Directive 2011/65/EU WEEE Directive 2012/19/EU UL 60950-1, 2nd Edition, 2014-10-14 CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-010 UL/CSA 62368-1, 2nd Edition AS/NZ CISPR 32:2015 AS/NZ CISPR 22:2009 +A1:2010 Taiwan BSMI EMC standard CNS 13438 Korea KCC Article 11.1 Morocco Decree # 2574-14 (EMC) Canada ICES-003 Japan VCCI China EFUP |
| SSD form factor | 3.5" |
| Random latency - read (up to) | 102 µs |
| Random latency - write (up to) | 49 µs |
| Sequential latency - read (up to) | 36 µs |
| Sequential latency - write (up to) | 36 µs |
| Drive writes per day (DWPD) | 2.5 |
| Power | |
| Power consumption (write) | 3 W |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage relative humidity (H-H) | 5 - 95% |
| Operating shock | 1000 G |
| Non-operating shock | 1000 G |
| Operating vibration | 2.17 G |
| Non-operating vibration | 3.13 G |
| Technical details | |
| Interface | Serial ATA III |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage relative humidity (H-H) | 5 - 95% |
| Operating shock | 1000 G |
| Non-operating shock | 1000 G |
| Operating vibration | 2.17 G |
| Non-operating vibration | 3.13 G |
| SSD form factor | 3.5" |
| Weight & dimensions | |
| Width | 257 mm |
| Weight | 484 g |
| Height | 95 mm |
| Depth | 193 mm |
| Other features | |
| Uncorrectable Bit Error Rate (UBER) | < 1 per 10^17 bits read |
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