Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016
Performance
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
240 GB
Security algorithms
256-bit AES
S.M.A.R.T. support
Yes
Read speed
540 MB/s
Write speed
380 MB/s
Memory type
3D TLC NAND
Random write (4KB)
60000 IOPS
Random read (4KB)
82000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
300 µs
Read latency
175 µs
Hardware encryption
Yes
Data transfer rate
6 Gbit/s
Design
Component for
Server/workstation
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016
SSD form factor
3.5"
Features
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
240 GB
Security algorithms
256-bit AES
S.M.A.R.T. support
Yes
Read speed
540 MB/s
Write speed
380 MB/s
Memory type
3D TLC NAND
Random write (4KB)
60000 IOPS
Random read (4KB)
82000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
300 µs
Read latency
175 µs
Hardware encryption
Yes
Data transfer rate
6 Gbit/s
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016
Performance
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
240 GB
Security algorithms
256-bit AES
S.M.A.R.T. support
Yes
Read speed
540 MB/s
Write speed
380 MB/s
Memory type
3D TLC NAND
Random write (4KB)
60000 IOPS
Random read (4KB)
82000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
300 µs
Read latency
175 µs
Hardware encryption
Yes
Data transfer rate
6 Gbit/s
Design
Component for
Server/workstation
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016
SSD form factor
3.5"
Features
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
240 GB
Security algorithms
256-bit AES
S.M.A.R.T. support
Yes
Read speed
540 MB/s
Write speed
380 MB/s
Memory type
3D TLC NAND
Random write (4KB)
60000 IOPS
Random read (4KB)
82000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
300 µs
Read latency
175 µs
Hardware encryption
Yes
Data transfer rate
6 Gbit/s
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS FCC: CFR Title 47, Part 15 Class B UL: UL-60950-1, 2nd Edition BSMI (Taiwan): approval to CNS 13438 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KCC RRL (Korea): approval to KN 32 Class B, KN 35 Class B W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): CISPR32 Class B: Canadian ICES-003:2016
UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C-tick MIC KCC
Certificates
Certification
UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C-tick MIC KCC
System requirements
Windows operating systems supported
Yes
Linux operating systems supported
Yes
Features
Interface
PCI Express
SSD capacity
300 GB
Windows operating systems supported
Yes
Read speed
1500 MB/s
Write speed
500 MB/s
Linux operating systems supported
Yes
ECC
Yes
Memory type
MLC
Random write (4KB)
172000 IOPS
Random read (4KB)
79000 IOPS
Certification
UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C-tick MIC KCC
Compatible products
System X 3650 M4
Operational conditions
Operating temperature (T-T)
5 - 40 °C
Storage temperature (T-T)
-40 - 60 °C
Operating relative humidity (H-H)
8 - 85%
Storage relative humidity (H-H)
8 - 85%
Maximum operating altitude
3048 m
Technical details
Interface
PCI Express
Operating temperature (T-T)
5 - 40 °C
Storage temperature (T-T)
-40 - 60 °C
Operating relative humidity (H-H)
8 - 85%
ECC
Yes
Storage relative humidity (H-H)
8 - 85%
Maximum operating altitude
3048 m
Latency
50 μs
Connector(s)
PCIe 2.0 x8
Compatible operating systems
Microsoft Windows Server 2012 Microsoft Windows Server 2008 R2 Microsoft Windows Server 2008, Datacenter x64 Edition Microsoft Windows Server 2008, Enterprise x64 Edition Microsoft Windows Server 2008, Web x64 Edition Red Hat Enterprise Linux 6 Server x64 Edition Red Hat Enterprise Linux 5 Server x64 Edition Red Hat Enterprise Linux 5 Server with Xen x64 Edition SUSE Linux Enterprise Server 11 for AMD64/EM64T SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T SUSE Linux Enterprise Server 10 for AMD64/EM64T SUSE Linux Enterprise Server 10 with Xen for AMD64/EM64T VMware vSphere 5.1 VMware vSphere 5 VMware ESX 4.1 VMware ESXi 4.1
Software
Windows operating systems supported
Yes
Linux operating systems supported
Yes
Weight & dimensions
Width
68 mm
Weight
227 g
Height
16 mm
Depth
168 mm
Other features
Latency
50 μs
Endurance rating
11.5 PB
Connector(s)
PCIe 2.0 x8
Compatible operating systems
Microsoft Windows Server 2012 Microsoft Windows Server 2008 R2 Microsoft Windows Server 2008, Datacenter x64 Edition Microsoft Windows Server 2008, Enterprise x64 Edition Microsoft Windows Server 2008, Web x64 Edition Red Hat Enterprise Linux 6 Server x64 Edition Red Hat Enterprise Linux 5 Server x64 Edition Red Hat Enterprise Linux 5 Server with Xen x64 Edition SUSE Linux Enterprise Server 11 for AMD64/EM64T SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T SUSE Linux Enterprise Server 10 for AMD64/EM64T SUSE Linux Enterprise Server 10 with Xen for AMD64/EM64T VMware vSphere 5.1 VMware vSphere 5 VMware ESX 4.1 VMware ESXi 4.1
UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C-tick MIC KCC
Certificates
Certification
UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C-tick MIC KCC
System requirements
Windows operating systems supported
Yes
Linux operating systems supported
Yes
Features
Interface
PCI Express
SSD capacity
300 GB
Windows operating systems supported
Yes
Read speed
1500 MB/s
Write speed
500 MB/s
Linux operating systems supported
Yes
ECC
Yes
Memory type
MLC
Random write (4KB)
172000 IOPS
Random read (4KB)
79000 IOPS
Certification
UL cUL IEC60950 EMC FCC TUV VDE CE VCCI BSMI C-tick MIC KCC
Compatible products
System X 3650 M4
Operational conditions
Operating temperature (T-T)
5 - 40 °C
Storage temperature (T-T)
-40 - 60 °C
Operating relative humidity (H-H)
8 - 85%
Storage relative humidity (H-H)
8 - 85%
Maximum operating altitude
3048 m
Technical details
Interface
PCI Express
Operating temperature (T-T)
5 - 40 °C
Storage temperature (T-T)
-40 - 60 °C
Operating relative humidity (H-H)
8 - 85%
ECC
Yes
Storage relative humidity (H-H)
8 - 85%
Maximum operating altitude
3048 m
Latency
50 μs
Connector(s)
PCIe 2.0 x8
Compatible operating systems
Microsoft Windows Server 2012 Microsoft Windows Server 2008 R2 Microsoft Windows Server 2008, Datacenter x64 Edition Microsoft Windows Server 2008, Enterprise x64 Edition Microsoft Windows Server 2008, Web x64 Edition Red Hat Enterprise Linux 6 Server x64 Edition Red Hat Enterprise Linux 5 Server x64 Edition Red Hat Enterprise Linux 5 Server with Xen x64 Edition SUSE Linux Enterprise Server 11 for AMD64/EM64T SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T SUSE Linux Enterprise Server 10 for AMD64/EM64T SUSE Linux Enterprise Server 10 with Xen for AMD64/EM64T VMware vSphere 5.1 VMware vSphere 5 VMware ESX 4.1 VMware ESXi 4.1
Software
Windows operating systems supported
Yes
Linux operating systems supported
Yes
Weight & dimensions
Width
68 mm
Weight
227 g
Height
16 mm
Depth
168 mm
Other features
Latency
50 μs
Endurance rating
11.5 PB
Connector(s)
PCIe 2.0 x8
Compatible operating systems
Microsoft Windows Server 2012 Microsoft Windows Server 2008 R2 Microsoft Windows Server 2008, Datacenter x64 Edition Microsoft Windows Server 2008, Enterprise x64 Edition Microsoft Windows Server 2008, Web x64 Edition Red Hat Enterprise Linux 6 Server x64 Edition Red Hat Enterprise Linux 5 Server x64 Edition Red Hat Enterprise Linux 5 Server with Xen x64 Edition SUSE Linux Enterprise Server 11 for AMD64/EM64T SUSE Linux Enterprise Server 11 with Xen for AMD64/EM64T SUSE Linux Enterprise Server 10 for AMD64/EM64T SUSE Linux Enterprise Server 10 with Xen for AMD64/EM64T VMware vSphere 5.1 VMware vSphere 5 VMware ESX 4.1 VMware ESXi 4.1
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Performance
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
960 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
65000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
35 µs
Read latency
170 µs
Design
Component for
Server/workstation
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
SSD form factor
2.5"
Features
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
960 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
65000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
35 µs
Read latency
170 µs
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Performance
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
960 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
65000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
35 µs
Read latency
170 µs
Design
Component for
Server/workstation
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
SSD form factor
2.5"
Features
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
960 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
65000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
35 µs
Read latency
170 µs
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Performance
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
480 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
37000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
42 µs
Read latency
170 µs
Compatible products
ThinkSystem
Design
Component for
Server/workstation
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
SSD form factor
M.2
Features
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
480 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
37000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
42 µs
Read latency
170 µs
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
Performance
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
480 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
37000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
42 µs
Read latency
170 µs
Compatible products
ThinkSystem
Design
Component for
Server/workstation
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)
SSD form factor
M.2
Features
Interface
Serial ATA III
Component for
Server/workstation
Hot-swap
Yes
SSD capacity
480 GB
S.M.A.R.T. support
Yes
Memory type
3D TLC NAND
Random write (4KB)
37000 IOPS
Random read (4KB)
95000 IOPS
Mean time between failures (MTBF)
3000000 h
Write latency
42 µs
Read latency
170 µs
Certification
Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139)