Name: Micron 7450 PRO U.3 7.68 TB PCI Express 4.0 3D TLC NAND NVMe
Brand: Micron
SKU: MTFDKCC7T6TFR-1BC1ZABYYR
Price: 1090.04 GBP
Availability: InStock

Corsair MP600 PRO XT M.2 2 TB PCI Express 4.0 3D TLC NAND NVMe

£194.27

RRP £281.69

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Corsair MP600 PRO XT M.2 1 TB PCI Express 4.0 3D TLC NAND NVMe

£117.54

RRP £157.71

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Corsair MP600 M.2 1 TB PCI Express 4.0 3D TLC NAND NVMe

£108.85

RRP £161.46

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Corsair MP600 PRO LPX M.2 1 TB PCI Express 4.0 3D TLC NAND NVMe

£110.71

RRP £147.61

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Corsair MP600 PRO LPX M.2 500 GB PCI Express 4.0 3D TLC NAND NVMe

£77.77

RRP £113.41

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Corsair MP600 PRO LPX M.2 2 TB PCI Express 4.0 3D TLC NAND NVMe

£194.27

RRP £262.27

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Micron 7450 MAX U.3 6.4 TB PCI Express 4.0 3D TLC NAND NVMe

£1,340.52

RRP £1,742.68

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Micron 7450 MAX U.3 3.2 TB PCI Express 4.0 3D TLC NAND NVMe

3200GB, U.3, 3D TLC NAND, PCIe Gen4 1x4, NVMe 1.4, Non-SED

£678.22

RRP £892.98

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Micron 7450 MAX U.3 1.6 TB PCI Express 4.0 3D TLC NAND NVMe

1600GB, U.3, 3D TLC NAND, PCIe Gen4 1x4, NVMe 1.4, Non-SED

£417.44

RRP £605.29

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Micron 7450 PRO U.3 960 GB PCI Express 4.0 3D TLC NAND NVMe

960GB, U.3, 3D TLC NAND, PCIe Gen4 1x4, NVMe 1.4, Non-SED

£221.70

RRP £297.44

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Micron 7450 PRO U.3 3.84 TB PCI Express 4.0 3D TLC NAND NVMe

£591.17

RRP £847.34

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Micron 7450 PRO U.3 7.68 TB PCI Express 4.0 3D TLC NAND NVMe

£1,090.04

RRP £1,353.48

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Hard drive
PCI Express interface data lanes	x4
SSD capacity	2 TB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	1200000 IOPS
Random read (4KB)	1000000 IOPS
Security
Security algorithms	256-bit AES
Endurance
Mean time between failures (MTBF)	1600000 h
Performance
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	6800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	1400
PCI Express interface data lanes	x4
SSD capacity	2 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	Yes
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	1000000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
Design
Cooling type	Heatsink
SSD form factor	M.2
Features
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	6800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	1400
PCI Express interface data lanes	x4
SSD capacity	2 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	Yes
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	1000000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption DevSlp (device sleep)	2 mW
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Maximum operating temperature	70 °C
Technical details
Interface	PCI Express 4.0
S.M.A.R.T. support	Yes
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Hardware encryption	Yes
SSD form factor	M.2
Weight & dimensions
Width	23 mm
Weight	66 g
Height	19 mm
Depth	80 mm
Logistics data
Harmonized System (HS) code	84717070
Other features
Cooling type	Heatsink

Hard drive
PCI Express interface data lanes	x4
SSD capacity	2 TB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	1200000 IOPS
Random read (4KB)	1000000 IOPS
Security
Security algorithms	256-bit AES
Endurance
Mean time between failures (MTBF)	1600000 h
Performance
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	6800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	1400
PCI Express interface data lanes	x4
SSD capacity	2 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	Yes
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	1000000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
Design
Cooling type	Heatsink
SSD form factor	M.2
Features
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	6800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	1400
PCI Express interface data lanes	x4
SSD capacity	2 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	Yes
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	1000000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption DevSlp (device sleep)	2 mW
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Maximum operating temperature	70 °C
Technical details
Interface	PCI Express 4.0
S.M.A.R.T. support	Yes
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Hardware encryption	Yes
SSD form factor	M.2
Weight & dimensions
Width	23 mm
Weight	66 g
Height	19 mm
Depth	80 mm
Logistics data
Harmonized System (HS) code	84717070
Other features
Cooling type	Heatsink

Hard drive
PCI Express interface data lanes	x4
SSD capacity	1 TB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	1200000 IOPS
Random read (4KB)	900000 IOPS
Security
Security algorithms	256-bit AES
Endurance
Mean time between failures (MTBF)	1600000 h
Performance
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	5800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	700
PCI Express interface data lanes	x4
SSD capacity	1 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	No
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	900000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
Design
Cooling type	Heatsink
SSD form factor	M.2
Features
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	5800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	700
PCI Express interface data lanes	x4
SSD capacity	1 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	No
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	900000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption DevSlp (device sleep)	2 mW
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Maximum operating temperature	70 °C
Technical details
Interface	PCI Express 4.0
S.M.A.R.T. support	No
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Hardware encryption	Yes
SSD form factor	M.2
Weight & dimensions
Width	23 mm
Weight	66 g
Height	19 mm
Depth	80 mm
Logistics data
Harmonized System (HS) code	84717070
Other features
Cooling type	Heatsink

Hard drive
PCI Express interface data lanes	x4
SSD capacity	1 TB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	1200000 IOPS
Random read (4KB)	900000 IOPS
Security
Security algorithms	256-bit AES
Endurance
Mean time between failures (MTBF)	1600000 h
Performance
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	5800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	700
PCI Express interface data lanes	x4
SSD capacity	1 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	No
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	900000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
Design
Cooling type	Heatsink
SSD form factor	M.2
Features
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
Sequential write speed (CDM)	5800 MB/s
Sequential read speed (CDM)	7100 MB/s
DevSlp (device sleep) support	Yes
TBW rating	700
PCI Express interface data lanes	x4
SSD capacity	1 TB
Security algorithms	256-bit AES
S.M.A.R.T. support	No
Memory type	3D TLC NAND
Random write (4KB)	1200000 IOPS
Random read (4KB)	900000 IOPS
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption DevSlp (device sleep)	2 mW
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Maximum operating temperature	70 °C
Technical details
Interface	PCI Express 4.0
S.M.A.R.T. support	No
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Hardware encryption	Yes
SSD form factor	M.2
Weight & dimensions
Width	23 mm
Weight	66 g
Height	19 mm
Depth	80 mm
Logistics data
Harmonized System (HS) code	84717070
Other features
Cooling type	Heatsink

Hard drive
PCI Express interface data lanes	x4
SSD capacity	1000 GB
Memory type	3D TLC NAND
Performance
Interface	PCI Express 4.0
Component for	PC/notebook
NVMe	Yes
PCI Express interface data lanes	x4
SSD capacity	1000 GB
Memory type	3D TLC NAND
Design
Component for	PC/notebook
SSD form factor	M.2
Features
Interface	PCI Express 4.0
Component for	PC/notebook
NVMe	Yes
PCI Express interface data lanes	x4
SSD capacity	1000 GB
Memory type	3D TLC NAND
SSD form factor	M.2
Harmonized System (HS) code	84717070
Technical details
Interface	PCI Express 4.0
SSD form factor	M.2
Weight & dimensions
Weight	34 g
Logistics data
Harmonized System (HS) code	84717070

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Hard drive
PCI Express interface data lanes	x4
SSD capacity	500 GB
Memory type	3D TLC NAND
Security
Security algorithms	256-bit AES
Endurance
Mean time between failures (MTBF)	1600000 h
Performance
Interface	PCI Express 4.0
Component for	Game console
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	500 GB
Security algorithms	256-bit AES
Memory type	3D TLC NAND
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
Compatible products	PS5
Design
Component for	Game console
SSD form factor	M.2
Features
Interface	PCI Express 4.0
Component for	Game console
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	500 GB
Security algorithms	256-bit AES
Memory type	3D TLC NAND
Mean time between failures (MTBF)	1600000 h
Hardware encryption	Yes
SSD form factor	M.2
Compatible products	PS5
Harmonized System (HS) code	84717070
Power
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Maximum operating temperature	70 °C
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Hardware encryption	Yes
SSD form factor	M.2
Weight & dimensions
Width	23 mm
Weight	34 g
Height	11 mm
Depth	80 mm
Packaging data
Quick start guide	Yes
Packaging content
Quick start guide	Yes
Logistics data
Harmonized System (HS) code	84717070

Hard drive
PCI Express interface data lanes	x4
SSD capacity	6400 GB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	400000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Endurance
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Performance
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	6400 GB
Memory type	3D TLC NAND
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Random write (4KB)	400000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Hardware encryption	Yes
Design
Component for	Server/workstation
SSD form factor	U.3
Features
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	6400 GB
Memory type	3D TLC NAND
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Random write (4KB)	400000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Hardware encryption	Yes
SSD form factor	U.3
Harmonized System (HS) code	84717070
Target workload	Mixed Use (MU)
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 70 °C
Hardware encryption	Yes
SSD form factor	U.3
Logistics data
Harmonized System (HS) code	84717070
Other features
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read

Hard drive
PCI Express interface data lanes	x4
SSD capacity	3.84 TB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	180000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Endurance
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Performance
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	3.84 TB
Memory type	3D TLC NAND
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Random write (4KB)	180000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Hardware encryption	Yes
Design
Component for	Server/workstation
SSD form factor	U.3
Features
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	3.84 TB
Memory type	3D TLC NAND
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Random write (4KB)	180000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Hardware encryption	Yes
SSD form factor	U.3
Target workload	Read Intensive (RI)
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 70 °C
Hardware encryption	Yes
SSD form factor	U.3
Other features
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read

Hard drive
PCI Express interface data lanes	x4
SSD capacity	7.68 TB
Memory type	3D TLC NAND
Data transmission
Random write (4KB)	215000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Endurance
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Performance
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	7.68 TB
Memory type	3D TLC NAND
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Random write (4KB)	215000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Hardware encryption	Yes
Design
Component for	Server/workstation
SSD form factor	U.3
Features
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
PCI Express interface data lanes	x4
SSD capacity	7.68 TB
Memory type	3D TLC NAND
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read
Random write (4KB)	215000 IOPS
Random read (4KB)	1000000 IOPS
Write latency	15 µs
Read latency	80 µs
Hardware encryption	Yes
SSD form factor	U.3
Target workload	Read Intensive (RI)
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 70 °C
Hardware encryption	Yes
SSD form factor	U.3
Other features
Uncorrectable Bit Error Rate (UBER)	< 1 per 10^17 bits read

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Tracking Information