Display
HDCP	Yes
Display brightness (typical)	300 cd/m²
Screen shape	Flat
Display number of colours	16.7 million colours
Native aspect ratio	16:9
Pixel density	158 ppi
Colour gamut	72%
Maximum refresh rate	60 Hz
HD type	Full HD
Display technology	LCD
Viewing angle, horizontal	178°
Viewing angle, vertical	178°
Pixel pitch	0.1611 x 0.1611 mm
Viewable size, horizontal	30.9 cm
Viewable size, vertical	17.4 cm
Digital horizontal frequency	30 - 80 kHz
Digital vertical frequency	56 - 61 Hz
Backlight type	LED
Display resolution	1920 x 1080 pixels
Response time	6 ms
Display diagonal	35.6 cm (14")
Contrast ratio (typical)	700:1
Touchscreen	No
Panel type	IPS
RGB colour space	NTSC
Display diagonal (metric)	35.56 cm
Anti-glare screen	Yes
Audio
Built-in speaker(s)	No
Performance
Built-in speaker(s)	No
Built-in camera	No
Management features
On Screen Display (OSD)	Yes
Plug and Play	Yes
Multimedia
Built-in speaker(s)	No
Built-in camera	No
Design
Market positioning	Business
Heavy metals free	Hg (mercury)
Product colour	Grey
Front bezel colour	Black
Camera
Built-in camera	No
Ports & interfaces
Headphone out	No
HDCP	Yes
HDMI	No
USB Power Delivery	Yes
USB Power Delivery up to	65 W
USB Type-C DisplayPort Alternate Mode	Yes
Number of USB Type-C upstream ports quantity	2
HDCP version	1.4
Technical details
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Cable lock slot	No
HDMI	No
Product colour	Grey
Front bezel colour	Black
Sustainability certificates	ENERGY STAR, RoHS
Doesn't contain	PVC/BFR
Power supply type	Internal
Weight (with stand)	590 g
Touchscreen	No
Ergonomics
VESA mounting	No
Cable lock slot	No
LED indicators	Yes
Tilt angle range	10 - 90°
On Screen Display (OSD)	Yes
Plug and Play	Yes
Height adjustment	No
Tilt adjustment	Yes
Power
Power supply type	Internal
Power consumption (max)	7.5 W
Power consumption (standby)	0.3 W
Power consumption (typical)	5 W
Power consumption (off)	0.3 W
Energy efficiency scale	A to G
Energy efficiency class (SDR)	B
Energy efficiency class (HDR)	Not available
Energy consumption (SDR) per 1000 hours	5 kWh
Operational conditions
Non-operating altitude	5000 - 12192 m
Operating temperature (T-T)	0 - 40 °C
Storage temperature (T-T)	-20 - 60 °C
Operating relative humidity (H-H)	10 - 80%
Storage relative humidity (H-H)	5 - 90%
Operating altitude	0 - 5000 m
Weight & dimensions
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Width (with stand)	322.4 mm
Depth (with stand)	14.3 mm
Height (with stand)	202.7 mm
Bezel width (side)	6.53 mm
Bezel width (top)	6.54 mm
Bezel width (bottom)	2.22 cm
Weight (with stand)	590 g
Package weight	1.12 kg
Packaging data
Package weight	1.12 kg
Sustainability
Sustainability certificates	ENERGY STAR, RoHS
Doesn't contain	PVC/BFR
European Product Registry for Energy Labelling (EPREL) code	1435998
Total carbon footprint	421 kg of CO2e
Indication
LED indicators	Yes
Carbon footprint
Total carbon footprint	421 kg of CO2e
Total carbon emissions (w/o Use phase)	374 kg of CO2e
Total carbon emissions (Standard deviation)	99 kg of CO2e
PAIA version	1.3.2
Carbon emissions (Use)	47 kg of CO2e
Carbon emissions (Manufacturing)	368 kg of CO2e
Carbon emissions (Logistics)	6 kg of CO2e
Carbon emissions (End-of-Life)	1 kg of CO2e
Logistics data
Total carbon footprint	421 kg of CO2e
Other features
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Power consumption (max)	7.5 W
HDMI	No
USB Power Delivery up to	65 W
Energy efficiency scale	A to G
USB Type-C DisplayPort Alternate Mode	Yes
Power supply type	Internal
Touchscreen	No
USB Power Delivery	Yes
Front bezel colour	Black

DELL P Series 14 Portable Monitor - P1424H

35.6cm (14") Full HD 1920 x 1080 LED IPS, 16:9, 300cd/m², 16.7M, 6ms, 178°/178°, 700:1

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SKU : DELL-P1424H
Part Number : 5397184821572
Manufacture : DELL

Hard drive
PCI Express interface data lanes	x4
SSD capacity	2000 GB
Memory type	TLC
Data transmission
Read speed	3400 MB/s
Write speed	3200 MB/s
Random write (4KB)	620000 IOPS
Random read (4KB)	680000 IOPS
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	800
PCI Express interface data lanes	x4
SSD capacity	2000 GB
Read speed	3400 MB/s
TRIM support	Yes
Write speed	3200 MB/s
Memory type	TLC
Random write (4KB)	620000 IOPS
Random read (4KB)	680000 IOPS
Mean time between failures (MTBF)	1500000 h
Design
Component for	Notebook
SSD form factor	M.2
Features
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	800
PCI Express interface data lanes	x4
SSD capacity	2000 GB
Read speed	3400 MB/s
TRIM support	Yes
Write speed	3200 MB/s
Memory type	TLC
Random write (4KB)	620000 IOPS
Random read (4KB)	680000 IOPS
Mean time between failures (MTBF)	1500000 h
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption (average)	7.6 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Technical details
Interface	PCI Express 3.1a
Operating temperature (T-T)	0 - 85 °C
TRIM support	Yes
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
SSD form factor	M.2
Weight & dimensions
Width	22.1 mm
Weight	10 g
Height	3.73 mm
Depth	80.2 mm

Hard drive
PCI Express interface data lanes	x4
SSD capacity	2000 GB
Memory type	TLC
Data transmission
Read speed	3400 MB/s
Write speed	3200 MB/s
Random write (4KB)	620000 IOPS
Random read (4KB)	680000 IOPS
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	800
PCI Express interface data lanes	x4
SSD capacity	2000 GB
Read speed	3400 MB/s
TRIM support	Yes
Write speed	3200 MB/s
Memory type	TLC
Random write (4KB)	620000 IOPS
Random read (4KB)	680000 IOPS
Mean time between failures (MTBF)	1500000 h
Design
Component for	Notebook
SSD form factor	M.2
Features
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	800
PCI Express interface data lanes	x4
SSD capacity	2000 GB
Read speed	3400 MB/s
TRIM support	Yes
Write speed	3200 MB/s
Memory type	TLC
Random write (4KB)	620000 IOPS
Random read (4KB)	680000 IOPS
Mean time between failures (MTBF)	1500000 h
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption (average)	7.6 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Technical details
Interface	PCI Express 3.1a
Operating temperature (T-T)	0 - 85 °C
TRIM support	Yes
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
SSD form factor	M.2
Weight & dimensions
Width	22.1 mm
Weight	10 g
Height	3.73 mm
Depth	80.2 mm

Hard drive
PCI Express interface data lanes	x4
SSD capacity	500 GB
Memory type	TLC
Data transmission
Read speed	1700 MB/s
Write speed	1600 MB/s
Random write (4KB)	400000 IOPS
Random read (4KB)	350000 IOPS
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	200
PCI Express interface data lanes	x4
SSD capacity	500 GB
Read speed	1700 MB/s
TRIM support	Yes
Write speed	1600 MB/s
Memory type	TLC
Random write (4KB)	400000 IOPS
Random read (4KB)	350000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
Design
Component for	Notebook
SSD form factor	M.2
Features
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	200
PCI Express interface data lanes	x4
SSD capacity	500 GB
Read speed	1700 MB/s
TRIM support	Yes
Write speed	1600 MB/s
Memory type	TLC
Random write (4KB)	400000 IOPS
Random read (4KB)	350000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption (average)	5.3 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Technical details
Interface	PCI Express 3.1a
Operating temperature (T-T)	0 - 85 °C
TRIM support	Yes
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Hardware encryption	No
SSD form factor	M.2
Weight & dimensions
Width	22.1 mm
Weight	6.9 g
Height	2.23 mm
Depth	80.2 mm
Logistics data
Harmonized System (HS) code	84717070

Hard drive
PCI Express interface data lanes	x4
SSD capacity	500 GB
Memory type	TLC
Data transmission
Read speed	1700 MB/s
Write speed	1600 MB/s
Random write (4KB)	400000 IOPS
Random read (4KB)	350000 IOPS
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	200
PCI Express interface data lanes	x4
SSD capacity	500 GB
Read speed	1700 MB/s
TRIM support	Yes
Write speed	1600 MB/s
Memory type	TLC
Random write (4KB)	400000 IOPS
Random read (4KB)	350000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
Design
Component for	Notebook
SSD form factor	M.2
Features
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
TBW rating	200
PCI Express interface data lanes	x4
SSD capacity	500 GB
Read speed	1700 MB/s
TRIM support	Yes
Write speed	1600 MB/s
Memory type	TLC
Random write (4KB)	400000 IOPS
Random read (4KB)	350000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
SSD form factor	M.2
Harmonized System (HS) code	84717070
Power
Power consumption (average)	5.3 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Technical details
Interface	PCI Express 3.1a
Operating temperature (T-T)	0 - 85 °C
TRIM support	Yes
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Hardware encryption	No
SSD form factor	M.2
Weight & dimensions
Width	22.1 mm
Weight	6.9 g
Height	2.23 mm
Depth	80.2 mm
Logistics data
Harmonized System (HS) code	84717070

Hard drive
SSD capacity	480 GB
Memory type	TLC 3D NAND
Data transmission
Read speed	555 MB/s
Write speed	540 MB/s
Random write (4KB)	88000 IOPS
Random read (4KB)	82000 IOPS
Data transfer rate	6 Gbit/s
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	Serial ATA III
Component for	Notebook
NVMe	No
DevSlp (device sleep) support	Yes
TBW rating	120
SSD capacity	480 GB
Read speed	555 MB/s
TRIM support	Yes
Write speed	540 MB/s
Memory type	TLC 3D NAND
Random write (4KB)	88000 IOPS
Random read (4KB)	82000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
Data transfer rate	6 Gbit/s
Design
Component for	Notebook
SSD form factor	2.5"
Features
Interface	Serial ATA III
Component for	Notebook
NVMe	No
DevSlp (device sleep) support	Yes
TBW rating	120
SSD capacity	480 GB
Read speed	555 MB/s
TRIM support	Yes
Write speed	540 MB/s
Memory type	TLC 3D NAND
Random write (4KB)	88000 IOPS
Random read (4KB)	82000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
Data transfer rate	6 Gbit/s
SSD form factor	2.5"
Harmonized System (HS) code	84717070
Power
Power consumption (average)	1.6 W
Power consumption (idle)	1.6 W
Operating voltage	5 V
Operational conditions
Operating temperature (T-T)	0 - 65 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Operating vibration	20 G
Technical details
Interface	Serial ATA III
Operating temperature (T-T)	0 - 65 °C
TRIM support	Yes
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Operating vibration	20 G
Hardware encryption	No
SSD form factor	2.5"
Weight & dimensions
Width	70.1 mm
Weight	45.6 g
Height	7.2 mm
Depth	100.5 mm
Logistics data
Harmonized System (HS) code	84717070

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Tracking Information

Hard drive
SSD capacity	960 GB
Memory type	TLC
Data transmission
Read speed	555 MB/s
Write speed	540 MB/s
Random write (4KB)	88000 IOPS
Random read (4KB)	81000 IOPS
Data transfer rate	6 Gbit/s
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	Serial ATA III
Component for	Notebook
NVMe	No
DevSlp (device sleep) support	Yes
TBW rating	240
SSD capacity	960 GB
Read speed	555 MB/s
TRIM support	Yes
Write speed	540 MB/s
Memory type	TLC
Random write (4KB)	88000 IOPS
Random read (4KB)	81000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
Data transfer rate	6 Gbit/s
Design
Component for	Notebook
SSD form factor	2.5"
Features
Interface	Serial ATA III
Component for	Notebook
NVMe	No
DevSlp (device sleep) support	Yes
TBW rating	240
SSD capacity	960 GB
Read speed	555 MB/s
TRIM support	Yes
Write speed	540 MB/s
Memory type	TLC
Random write (4KB)	88000 IOPS
Random read (4KB)	81000 IOPS
Mean time between failures (MTBF)	1500000 h
Hardware encryption	No
Data transfer rate	6 Gbit/s
SSD form factor	2.5"
Harmonized System (HS) code	84717070
Power
Power consumption (average)	1.7 W
Power consumption (idle)	1.7 W
Operating voltage	5 V
Operational conditions
Operating temperature (T-T)	0 - 65 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Operating vibration	20 G
Technical details
Interface	Serial ATA III
Operating temperature (T-T)	0 - 65 °C
TRIM support	Yes
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1500 G
Operating vibration	20 G
Hardware encryption	No
SSD form factor	2.5"
Weight & dimensions
Width	70.1 mm
Weight	45.7 g
Height	7.2 mm
Depth	100.5 mm
Logistics data
Harmonized System (HS) code	84717070

Hard drive
SSD capacity	1000 GB
Memory type	BiCS FLASH TLC
Data transmission
Read speed	2100 MB/s
Write speed	1700 MB/s
Random write (4KB)	400000 IOPS
Random read (4KB)	400000 IOPS
Data transfer rate	32 Gbit/s
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
SSD capacity	1000 GB
Read speed	2100 MB/s
Write speed	1700 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	400000 IOPS
Random read (4KB)	400000 IOPS
Mean time between failures (MTBF)	1500000 h
Data transfer rate	32 Gbit/s
Design
Component for	Notebook
SSD form factor	M.2
Features
Interface	PCI Express 3.1a
Component for	Notebook
NVMe	Yes
NVMe version	1.3c
SSD capacity	1000 GB
Read speed	2100 MB/s
Write speed	1700 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	400000 IOPS
Random read (4KB)	400000 IOPS
Mean time between failures (MTBF)	1500000 h
Data transfer rate	32 Gbit/s
SSD form factor	M.2
Power
Power consumption (max)	3.5 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Technical details
Interface	PCI Express 3.1a
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
SSD form factor	M.2
Weight & dimensions
Width	80.2 mm
Weight	6.8 g
Height	22.1 mm
Depth	2.23 mm

Hard drive
SSD capacity	1.02 TB
Memory type	BiCS FLASH TLC
Data transmission
Read speed	3500 MB/s
Write speed	2900 MB/s
Random write (4KB)	450 IOPS
Random read (4KB)	500 IOPS
Data transfer rate	64 Gbit/s
Performance
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
SSD capacity	1.02 TB
Read speed	3500 MB/s
Write speed	2900 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	450 IOPS
Random read (4KB)	500 IOPS
Data transfer rate	64 Gbit/s
Design
Component for	Server/workstation
SSD form factor	M.2
Features
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
SSD capacity	1.02 TB
Read speed	3500 MB/s
Write speed	2900 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	450 IOPS
Random read (4KB)	500 IOPS
Data transfer rate	64 Gbit/s
SSD form factor	M.2
Power
Power consumption (max)	4.3 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-40 - 85 °C
Operating relative humidity (H-H)	0 - 90%
Operating shock	1500 G
Non-operating shock	1500 G
Operating vibration	20 G
Non-operating vibration	20 G
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-40 - 85 °C
Operating relative humidity (H-H)	0 - 90%
Operating shock	1500 G
Non-operating shock	1500 G
Operating vibration	20 G
Non-operating vibration	20 G
SSD form factor	M.2
Weight & dimensions
Width	22 mm
Weight	3 g
Height	2.23 mm
Depth	30 mm

Hard drive
SSD capacity	1 TB
Memory type	BiCS FLASH TLC
Data transmission
Read speed	5000 MB/s
Write speed	3900 MB/s
Data transfer rate	64 Gbit/s
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
TBW rating	1200
SSD capacity	1 TB
Read speed	5000 MB/s
Write speed	3900 MB/s
Memory type	BiCS FLASH TLC
Mean time between failures (MTBF)	1500000 h
Data transfer rate	64 Gbit/s
Random read	770000 IOPS
Random write	950000 IOPS
Design
SSD form factor	M.2
Features
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
TBW rating	1200
SSD capacity	1 TB
Read speed	5000 MB/s
Write speed	3900 MB/s
Memory type	BiCS FLASH TLC
Mean time between failures (MTBF)	1500000 h
Data transfer rate	64 Gbit/s
SSD form factor	M.2
Random read	770000 IOPS
Random write	950000 IOPS
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
SSD form factor	M.2
Sustainability certificates	RoHS
Weight & dimensions
Width	22.1 mm
Weight	7 g
Height	2.63 mm
Depth	80.2 mm

Hard drive
SSD capacity	2 TB
Memory type	BiCS FLASH TLC
Data transmission
Read speed	5000 MB/s
Write speed	3900 MB/s
Data transfer rate	64 Gbit/s
Endurance
Mean time between failures (MTBF)	1500000 h
Performance
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
TBW rating	1200
SSD capacity	2 TB
Read speed	5000 MB/s
Write speed	3900 MB/s
Memory type	BiCS FLASH TLC
Mean time between failures (MTBF)	1500000 h
Data transfer rate	64 Gbit/s
Random read	680000 IOPS
Random write	950000 IOPS
Design
SSD form factor	M.2
Features
Interface	PCI Express 4.0
NVMe	Yes
NVMe version	1.4
TBW rating	1200
SSD capacity	2 TB
Read speed	5000 MB/s
Write speed	3900 MB/s
Memory type	BiCS FLASH TLC
Mean time between failures (MTBF)	1500000 h
Data transfer rate	64 Gbit/s
SSD form factor	M.2
Random read	680000 IOPS
Random write	950000 IOPS
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-40 - 85 °C
Operating shock	1000 G
Operating vibration	20 G
SSD form factor	M.2
Sustainability certificates	RoHS
Weight & dimensions
Width	22.1 mm
Weight	7 g
Height	2.63 mm
Depth	80.2 mm

Hard drive
SSD capacity	512 GB
Memory type	BiCS FLASH TLC
Data transmission
Read speed	3500 MB/s
Write speed	2700 MB/s
Random write (4KB)	430 IOPS
Random read (4KB)	400 IOPS
Data transfer rate	64 Gbit/s
Performance
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
SSD capacity	512 GB
Read speed	3500 MB/s
Write speed	2700 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	430 IOPS
Random read (4KB)	400 IOPS
Data transfer rate	64 Gbit/s
Design
Component for	Server/workstation
SSD form factor	M.2
Features
Interface	PCI Express 4.0
Component for	Server/workstation
NVMe	Yes
NVMe version	1.4
SSD capacity	512 GB
Read speed	3500 MB/s
Write speed	2700 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	430 IOPS
Random read (4KB)	400 IOPS
Data transfer rate	64 Gbit/s
SSD form factor	M.2
Power
Power consumption (max)	4.1 W
Operating voltage	3.3 V
Operational conditions
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-40 - 85 °C
Operating relative humidity (H-H)	0 - 90%
Operating shock	1500 G
Non-operating shock	1500 G
Operating vibration	20 G
Non-operating vibration	20 G
Technical details
Interface	PCI Express 4.0
Operating temperature (T-T)	0 - 95 °C
Storage temperature (T-T)	-40 - 85 °C
Operating relative humidity (H-H)	0 - 90%
Operating shock	1500 G
Non-operating shock	1500 G
Operating vibration	20 G
Non-operating vibration	20 G
SSD form factor	M.2
Weight & dimensions
Width	22 mm
Weight	2.9 g
Height	2.23 mm
Depth	30 mm

Hard drive
SSD capacity	1920 GB
Memory type	BiCS FLASH TLC
Data transmission
Read speed	4200 MB/s
Write speed	3400 MB/s
Random write (4KB)	155000 IOPS
Random read (4KB)	720000 IOPS
Data transfer rate	22.5 Gbit/s
Security
Security algorithms	FIPS 140-2, FIPS 140-3
Endurance
Mean time between failures (MTBF)	2500000 h
Performance
Interface	SAS
Component for	Server/workstation
End-to-End Data Protection	Yes
SSD capacity	1920 GB
Security algorithms	FIPS 140-2, FIPS 140-3
Read speed	4200 MB/s
Write speed	3400 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	155000 IOPS
Random read (4KB)	720000 IOPS
Mean time between failures (MTBF)	2500000 h
Hardware encryption	Yes
Data transfer rate	22.5 Gbit/s
Design
Component for	Server/workstation
SSD form factor	2.5"
Features
Interface	SAS
Component for	Server/workstation
End-to-End Data Protection	Yes
SSD capacity	1920 GB
Security algorithms	FIPS 140-2, FIPS 140-3
Read speed	4200 MB/s
Write speed	3400 MB/s
Memory type	BiCS FLASH TLC
Random write (4KB)	155000 IOPS
Random read (4KB)	720000 IOPS
Mean time between failures (MTBF)	2500000 h
Hardware encryption	Yes
Data transfer rate	22.5 Gbit/s
SSD form factor	2.5"
Power
Power consumption (average)	5 W
Operating voltage	12 V
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Operating relative humidity (H-H)	5 - 95%
Operating shock	1000 G
Operating vibration	2.17 G
Technical details
Interface	SAS
Operating temperature (T-T)	0 - 70 °C
Operating relative humidity (H-H)	5 - 95%
Operating shock	1000 G
Operating vibration	2.17 G
Hardware encryption	Yes
SSD form factor	2.5"
Weight & dimensions
Width	68.8 mm
Weight	150 g
Height	15 mm
Depth	100.5 mm

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